Infineon Technologies AG recently announced the expansion of its Bluetooth portfolio with eight new products in the AIROC™ CYW20829 low-power Bluetooth 5.4 microcontroller (MCU) family, including system-on-chip (SoC) and modules optimized for industrial, consumer and automotive use cases. With the high level of integration of the CYW20829 product family, designers can reduce bill of materials (BOM) costs and device footprint for a variety of applications, including personal computer (PC) accessories, low-power audio, wearable devices, solar micro inverters, asset trackers, health and lifestyle, home automation, etc. Designers can benefit from Infineon's rich development infrastructure and commitment to strong security. At the same time, Infineon also supports secure boot and execution environments and cryptographic acceleration to protect sensitive data.

 

The AIROC™ CYW89829 low-power Bluetooth MCU is the latest automotive part in the semiconductor product family, with strong RF performance, long range and the latest Bluetooth 5.4 features, including periodic broadcast with response (PAwR), which is ideal for automotive access and wireless battery management system (wBMS) applications. This series of chips adopts ARM® Cortex® dual-core design, with independent application and low-power Bluetooth subsystems, which can fully support Bluetooth 5.4, low power consumption, 10 dBm output power (no power amplifier required), integrated flash memory, CAN FD, encryption accelerator and high security including root of trust (RoT), and meet the requirements of PSA Level 1 security certification.

 

Shantanu Bhalerao, Vice President of Bluetooth Product Line of Infineon Technologies, said: "Infineon provides one of the broadest portfolios of IoT solutions in the industry. Our Bluetooth solutions have strong connectivity and the latest features. The AIROC™ CYW89829 automotive low-power Bluetooth MCU and AIROC™ CYW20829 multi-function low-power Bluetooth MCU have ultra-low power consumption and high integration characteristics, which can provide better user experience for various applications in the automotive, industrial and consumer markets."

 

Infineon has been working with customers to design existing products of the CYW20829 series and has received positive reviews:

 

ITON CEO Kevin Wang said: "Infineon CYW20829 is a leading Bluetooth component on the market and has passed the latest Bluetooth 5.4 certification. CYW20829 has very good RF performance and supports PAwR and low-power audio. These features bring more possibilities to the consumer and industrial markets."

 

"CYW20829 has excellent RF performance, flexible API and excellent long-range characteristics, providing excellent solutions for commercial lighting, industrial IoT and other fields."

 

"Earlier this year, the Bluetooth SIG released version 5.4 of the specification, adding two new features: periodic broadcast with response and encrypted broadcast data," said Tapan Pattnayak, chief scientist of Addverb, a global leader in the robotics industry. With these features implemented on the Infineon CYW20829 chip, Addverb has developed a security monitoring system for wireless robots in industrial warehouses to meet customer safety needs."

 

Availability

The new product has multiple models, each with its own characteristics and key applications.

 

Products currently in production include:

 

CYW20829B0000, in a 56QFN SoC package with a size of 6x6 mm, suitable for PC accessories, remote controls, electronic shelf labels and low-end low-power Bluetooth MCUs;

 

CYW20829B0010, in a 56QFN SoC package with a size of 6x6 mm, suitable for gaming accessories and low-power audio products;

 

CYW20829B0-P4EPI100 and CYW20829B0-P4TAI100 modules, both with a size of 14.5x19 mm, are suitable for long-range, asset tracking, power tools and general low-power Bluetooth use cases.

 

Currently sampling:

 

CYW20829B0021, in 40QFN SoC package, 6x6 mm, suitable for industrial and long-distance applications;

 

CYW89829B0022, in 40QFN SoC package, 6x6 mm, suitable for wireless battery management systems and automotive access;

 

CYW89829B0232, in 77BGA SoC package, 7x8 mm, suitable for wireless battery management systems and automotive access;

 

CYW20829B1230 will sample in the second quarter of 2025, in 64 Ball BGA SoC package, 4.5x4.5 mm, suitable for wearable devices, power tools and asset tracking.

 

About Infineon Technologies

Infineon Technologies AG is Germany's largest semiconductor manufacturer. The company was spun-off from Siemens AG in 1999. Infineon has about 58,600 employees in 2023 and is one of the ten largest semiconductor manufacturers worldwide. In 2023 the company achieved sales of €16.309 billion.

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