TI Introduces New Magnetic Packaging Technology, Reducing The Size Of Power Solutions By Half

The MagPack™ packaging technology reduces the size of the power module by up to 50% compared to the previous generation. The power density of the power module is doubled while maintaining the same heat dissipation performance.

Compared to its predecessor, the industry's ultra-small 6A power module reduces electromagnetic interference (EMI) radiation by 8dB while increasing efficiency by up to 2%.

Texas Instruments (TI) (NASDAQ: TXN) has introduced six new power modules designed to increase power density, improve efficiency and reduce EMI. Powered by Texas Instruments' proprietary MagPack integrated magnetic packaging technology, these power modules are up to 23 percent smaller than comparable products on the market, enabling designers in industrial, enterprise and communications applications to achieve higher levels of performance. Three of the six new devices (TPSM82866A, TPSM82866C, and TPSM82816) are ultra-small 6A power modules that can provide current output capacity of 1A per square millimeter.

Jeff Morroni, Director of Power Management Research and Development at Texas Instruments Kilby Labs, said: "Designers adopt power modules to save time, reduce complexity, reduce size and reduce the number of components, but before they need to compromise on performance. "After nearly a decade of work, Texas Instruments has introduced integrated magnetic packaging technology that enables power designers to adapt to the power supply trends reshaping the industry: efficiently delivering more power in a smaller space."

Greater output power in a smaller space

In power supply design, size matters. Power modules integrate the power chip with the transformer or inductor in a single package module, so you can simplify the power design and save valuable printed circuit board (PCB) layout space. The MagPack packaging technology uses Texas Instruments' unique 3D packaging molding process to minimize the height, width and depth of the power module, thereby providing more output power in a smaller space.

The magnetic package technology uses an integrated power inductor made of a proprietary new design material. By using this type of power module, engineers can more easily obtain high power density, low temperature, low EMI radiation, high conversion efficiency of the power system design. Some analysts predict that data center power demand will increase by 100 percent by 2030. The above performance advantages brought by power modules can play an important role in applications such as data centers to improve power efficiency.
For more information, see the technical article "MagPack Technology: Four Benefits of new Power modules that help you deliver more power in less space."

With decades of expertise and innovative technology, and a portfolio of more than 200 devices that offer optimized package types for power supply design or application, TI's power modules help designers push power further.

About Texas Instruments (TI)

Texas Instruments is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We are committed to making electronic products more economical and practical through semiconductor technology, and making the world a better place. Today, each generation of innovation builds on the last, making our technology more reliable, economical, and energy efficient, enabling the widespread use of semiconductors in electronics.

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