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TDA3LXRBFABFQ1

  • TDA3LXRBFABFQ1

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TDA3LXRBFABFQ1 Overview

TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture.

The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.

The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing.

Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

The TDA3x ADAS processor is qualified according to AEC-Q100 standard.

Features

  • Architecture designed for ADAS applications
  • Video and image processing support
  • Up to 2 C66x floating-point VLIW DSP
  • Fully object-code compatible with C67x and C64x+
  • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512kB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • Supports DDR3/DDR3L up to DDR-1066
  • Supports DDR2 up to DDR-800
  • Supports LPDDR2 up to DDR-667
  • Up to 2GB supported
  • Vision accelerationPac
  • Embedded Vision Engine (EVE)
  • Display subsystem
  • Display controller with DMA engine
  • CVIDEO / SD-DAC TV analog composite output
  • Video Input Port (VIP) module
  • Support for up to 4 multiplexed input ports
  • On-chip temperature sensor that is capable of generating temperature alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • CAN 2.0B protocol
  • CAN 2.0B protocol
  • Eight 32-bit general-purpose timers
  • Three configurable UART modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Two Inter-Integrated Circuit (I
  • 2
  • C ) ports
  • Three Multichannel Audio Serial Port (McASP) modules
  • Secure Digital Input Output Interface (SDIO)
  • Up to 126 General-Purpose I/O (GPIO) pins
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • Memory Cyclic Redundancy Check (CRC)
  • TESOC (LBIST/PBIST) that enables field testing of logic and on-chip memory
  • Error Signaling Module (ESM)
  • Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
  • 8-channel 10-bit ADC
  • MIPI
  • PWMSS
  • Full HW image pipe: DPC, CFA, 3D-NF, RGB-YUV

Product Parameters

  • genericPartNumber

    TDA3LX

  • partDescription

    Low power SoC w/ processing, imaging & vision acceleration for ADAS applications

  • statusDescription

    This product has been released to the market and is available for purchase. For some products, newer alternatives may be available.

  • packageQtyCarrier

    90|JEDEC TRAY (5+1)

  • orderablePartNumber

    TDA3LXRBFABFQ1

  • statusDisplay

    ACTIVE

  • packageQuantity

    90

  • packagePins

    FCBGA (ABF)|367

Technical Documents

  • ADC as Voltage Monitoring in TDA3xDetails>>

  • AM57x, DRA7x, and TDA2x EMIF Tools (Rev. E)Details>>

  • A Guide to Debugging With CCS on the DRA75x, DRA74x, TDA2x and TDA3x Family of D (Rev. B)Details>>

  • Flashing Utility - mflashDetails>>

  • ADAS Power ManagementDetails>>

Related Products

Other distributor's price

Distributor Part # Mfg. Description Price
arrow TDA3LXRBFABFQ1 Texas Instruments SoC for Advanced Driver Assistance Systems

750---$38.5800

1500---$38.1900

3000---$37.8100

6000---$37.4300

9000---$37.0600

12000---$36.6900

15000---$36.3200

24000---$35.9600

30000---$35.6000

45000---$35.2400
digikey TDA3LXRBFABFQ1 Texas Instruments IC SOC PROCESSOR

750---$36.8550
mouser TDA3LXRBFABFQ1 Texas Instruments Digital Signal Processors & Controllers - DSP, DSC Low power SoC w/ full-featured processing, imaging & vision acceleration for ADAS applications 367-FCBGA -40 to 125

750---$39.3200

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