Features

• AEC-Q100 qualified
• High performance e200z420n3 dual core
• 32-bit Power Architecture technology CPU
• Core frequency as high as 180 MHz
• Variable Length Encoding (VLE)
• 32-bit Power Architecture technology CPU
• Core frequency as high as 180 MHz
• Variable Length Encoding (VLE)
• 4224 KB (4096 KB code flash + 128 KB data flash) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
• 176 KB HSM dedicated flash memory (144 KB code + 32 KB data)
• 384 KB on-chip general-purpose SRAM (in addition to 128 KB core local data RAM: 64 KB included in each CPU)
• Multi-channel direct memory access controller (eDMA) with 64 channels
• 1 interrupt controller (INTC)
• Comprehensive new generation ASIL-B safety concept
• ASIL-B of ISO 26262
• FCCU for collection and reaction to failure notifications
• Memory Error Management Unit (MEMU) for collection and reporting of error events in memories
• Cyclic redundancy check (CRC) unit
• ASIL-B of ISO 26262
• FCCU for collection and reaction to failure notifications
• Memory Error Management Unit (MEMU) for collection and reporting of error events in memories
• Cyclic redundancy check (CRC) unit
• Crossbar switch architecture for concurrent access to peripherals, Flash, or RAM from multiple bus masters with end-to-end ECC
• Body cross triggering unit (BCTU)
• Triggers ADC conversions from any eMIOS channel
• Triggers ADC conversions from up to 2 dedicated PIT_RTIs
• Triggers ADC conversions from any eMIOS channel
• Triggers ADC conversions from up to 2 dedicated PIT_RTIs
• Enhanced modular IO subsystem (eMIOS): up to 64 timed I/O channels with 16-bit counter resolution
• Enhanced analog-to-digital converter system with:
• 3 independent fast 12-bit SAR analog converters
• 1 supervisor 12-bit SAR analog converter
• 1 10-bit SAR analog converter with STDBY mode support
• 3 independent fast 12-bit SAR analog converters
• 1 supervisor 12-bit SAR analog converter
• 1 10-bit SAR analog converter with STDBY mode support
• Communication interfaces
• 18 LINFlexD modules
• 8 deserial serial peripheral interface (DSPI) modules
• 8 MCAN interfaces with advanced shared memory scheme and ISO CAN-FD support
• Dual-channel FlexRay controller
• 1 ethernet controller 10/100 Mbps, compliant IEEE 802.3-2008
• 18 LINFlexD modules
• 8 deserial serial peripheral interface (DSPI) modules
• 8 MCAN interfaces with advanced shared memory scheme and ISO CAN-FD support
• Dual-channel FlexRay controller
• 1 ethernet controller 10/100 Mbps, compliant IEEE 802.3-2008
• Low power capabilities
• Versatile low power modes
• Ultra low power standby with RTC
• Smart Wake-up Unit for contact monitoring
• Fast wakeup schemes
• Versatile low power modes
• Ultra low power standby with RTC
• Smart Wake-up Unit for contact monitoring
• Fast wakeup schemes
• Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell
• Nexus development interface (NDI) per IEEE-ISTO 5001-2003 standard, with some support for 2010 standard
• Boot assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART
• Junction temperature range -40 °C to 150 °C